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VA.7
Visitor II
September 18, 2019
Question

Power dissipation and thermal resistance details required

  • September 18, 2019
  • 0 replies
  • 535 views

We are using "M41T80M6F" and "LM239ADT" in our design.We require power dissipation of this ic under typ,min and max conditions for thermal analysis.Also require "RθJB-Thermal resistance between Junction to Board",RθJC-Thermal resistance between Junction to Case ,RθJA-Thermal resistance between Junction to Ambient and Tjmax-Junction temperature.

 which is not available in the datasheet.Kindly help us to get the same asap.

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