Power dissipation and thermal resistance details required
We are using "M41T80M6F" and "LM239ADT" in our design.We require power dissipation of this ic under typ,min and max conditions for thermal analysis.Also require "RθJB-Thermal resistance between Junction to Board",RθJC-Thermal resistance between Junction to Case ,RθJA-Thermal resistance between Junction to Ambient and Tjmax-Junction temperature.
which is not available in the datasheet.Kindly help us to get the same asap.
