STM32WLE5 RF Design – Impact of Layer Stack-up Change on Matching Network

Hi everyone,

We are designing an RF PCB using the STM32WLE5JC6TR. For the RF section, we are following the MB1389 reference design of the STM32WL55 Nucleo board.

If we change the PCB layer stack-up (e.g., dielectric thickness, layer arrangement), will the RF matching component values need to be adjusted?

My understanding is that the stack-up affects the RF trace impedance, so I’m wondering:

Will changes in stack-up require recalculating the RF trace width and impedance?
Could this also impact the matching network component values, or are they generally reusable from the reference design?

Any guidance on how sensitive the matching network is to stack-up changes would be very helpful.

Thanks in advance!

Technical Moderator

Hello @Eranga and welcome to the Community;

I recommend you these guidelines for STM32 RF guideline courses and optimizing RF:

"When your question is answered, please close this topic by clicking ""Accept as Solution"".ThanksImen"

Sign up