IIS328DQ PCB Design Guidelines Unclear

[KTeng.1]

Not quite clear about the statement " "Pin 1 Indicator" unconnected during soldering " as mentioned in the datasheet. Can someone elaborate on this?

In the Recommended Land and Soldermask design, the statement "PCB THERMAL PAD NOT TO BE DESIGNED ON PCB". Does this mean it is not allow to have solderpad on the PCB? Do we only need to open the Soldermask?

[Eleon BORLINI]

Hi @KTeng.1​ , I believe that the indication on the datasheet is a refuse / typo... on some MEMS devices the "pin1 indicator" is on the same side of the pads that are soldered, but this is not the case for this device. Btw, I suggest you to check the IIS328DQ related Steval (STEVAL-MKI170V1) gerber files to check the suggested pcb layout for the device. No need to design the thermal pad opening on the PCB, because it is intended only to be a thermal dissipation, and it is already internally connected with GND pin.

Regards