LPS33W Reflow profile unclear

[SGano.1]

Hi.

According to the DS of the LPS33W - the Reflow profile should be according to JEDEC J-STD-020 , with no actual determination of the profile.

we had several boards assembled , and with very little force applied, the sensor disintegrated - the metal part from the plastic socket.

I suspect it might be the reflow profile that weaken the glue and caused this disintegration.

Is there a recommended profile for the LPS33W?

We have used before that the STEVAL-MKI205V1 - which is the LPS33W EVB ,

And had no such issue.

The pic below is of an actual reflow performed on the boards.

Thanks.

[SGano.1]

Hi @Eleon BORLINI​ 

We are encountering numerous problems with the LPS33W .

Is there an FAE is Israel we can turn to regarding this device?

[Eleon BORLINI]

Hi @SGano.1​ ,

I suggest you to contact a representative from your region the from the st.com contact page, to get more support and internal visibility -and eventually escalation- on this quality issue.

 

-Eleon