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Visitor II
March 22, 2018
Question

Over-molding of LSM9DS1

  • March 22, 2018
  • 2 replies
  • 1237 views
Posted on March 22, 2018 at 08:57

Hi, This question is regarding the e-packaging of the LSM9DS1 sensor PCBA 

Instead of packaging it in the plastic casing, We are planning to cover the PCBA with the overmolding material to cover the whole PCB including the sensor to protect it from moisture and environment.

Is overmolding advisable over the LSM9DS1 sensor given that it is a MEMS? If yes, do you suggest any specific material and process?

#lsm9ds1 #overmolding #packaging
    This topic has been closed for replies.

    2 replies

    Visitor II
    April 2, 2018
    Posted on April 02, 2018 at 12:50

    This has been floating for some time now, Does anyone has a view on this? It will be really helpful.

    Graduate II
    April 2, 2018
    Posted on April 02, 2018 at 14:09

    Potting or conformal coating?

    Suggest you talk with ST customer support representatives in your area, or ST FAE supporting your account.

    Visitor II
    April 3, 2018
    Posted on April 03, 2018 at 09:46

    Hi Clive, We are currently putting Void/Mask region over the sensor while we do a conformal coat.

    This question is rather related to the Potting/Overmolding over the Sensor and its PCBA.

    ST Employee
    April 5, 2018
    Posted on April 05, 2018 at 12:51

    Coating or overmolding is OK for the sensor.

    Please be aware of the maximum temperature which the sensor can withstand.