M24128-BRMN6P Thermal Information

[JW3]

Hi,

We are currently assessing the use of the M24128-BRMN6P on our prototype and the following thermal information (that is not available in the datasheet) will be useful for our thermal analysis:

1. Max. Operating Junction temperature (where functionality of the component is assured)
2. SIM model of the component
3. Theta JC (Resistance from junction to case) in degC/W
4. Theta JB (Resistance from junction to Board) in degC/W

Can these information be provided to us? Thank you!

[ahsrabrifat]

Not sure if ST tested these parameters. Let's see how they respond.