Application to stress in climatic chamber a STM32H7A3IIK6

[AMigl.1]

Hi everbody. I've developed a project for STM32H7A3IIK6 [BGA package] and i've mounted the bypass capacitor on the same side of the MCU [not on the opposite side as suggested by STM Application Note] because of problems related to my production process. Now i'd like to write an application to stress my MCU in climatic chamber to understand if, in this configuration, i could have problems like HardFault or similar. Is there in CubeMX or in some github STM repository, for this MCU [or similar], any kind of benchmark/application to stress the MCU? Could you suggest me what to implement to stress the MCU?

[Foued_KH]

Hello @Community member​ ,

I suggest you this link : STM32CubeH7/Projects/NUCLEO-H7A3ZI-Q at master · STMicroelectronics/STM32CubeH7 · GitHub

Foued

[AMigl.1]

Thank you so much @KHALSI_Foued​ . I'm looking for a benchmark to test the power of a STM32H7A3IIK6. A good test for this purpose could be a dhrystone or a whetstone example test but i've not found anything already implemented.Do you know where i could find something like this?

[Foued_KH]

You can find some results about the coreMark in the DS: Datasheet - STM32H7A3xI/G - 32-bit Arm® Cortex®-M7 280 MHz MCUs, up to 2-Mbyte Flash memory, 1.4-Mbyte RAM, 46 com. and analog interfaces, SMPS ( Table 37. Typical consumption in Run mode and corresponding performance versus code position )

Check also product presentation : microcontrollers_stm32h7a3-b3_line_product-overview.pdf

Foued

[AMigl.1]

Ok @KHALSI_Foued​ . But what i need is a benchmark example, like the one used by ST to build the report of Table37 of the DS, because i have to evaluate, in my own application, if i can mount the bypass capacitors on the same side of the MCU or if i need to mount them on the opposite side [it's a BGA package]. My problem is that, for my production line, it's better to mount the capacitors on the same side of the MCU.