STM32F779AI WLCSP 180 pins package layout examples

[pazcal]

I would like to use the STM32F779AI, in WLCSP package. I did not find any application notes, or schematics or dev board for such MCU.

Is there some litterature or example, schematics, ... talking about layout rules, VIAs, etc... for the WLCSP-180 (pitch 0.4mm) package.

Thanks in advance

Pascal

[Tesla DeLorean]

TBH I think the people you should start with are the PCBA guys you work with, they'll have a lot more insight into the board, stack-up, solder mask, and via-in-pad type stuff they can work with, and which PCB vendors do a good job of fill/planarization, etc.

[pazcal]

Thanks for answer, but the question came from the PCBA Guys.

BR

paz

[FBL]

Hi @pazcal​ 

Refer to this application note Getting started with STM32F7 Series MCU hardware development section 6.7 Recommendations for the WLCSP180 package then 8.5 WLCSP143 0.4 mm pitch design example

Also you can check the datasheet section 3 for more details about the pinout and package characteristics

[pazcal]

Thanks for your answer. The A.N will help

BR

paz