STM32G474 - Using WLCSP81 package on 1/4 brick power modual

[JTan.5]

Dear ST expert,

STM32G474 serials are very good option on digital power control, and I see the WLCSP81 package is pretty small(only 4mmx4mm). I plan to use WLCSP81 package on 1/4 bick power module which is 12 layers and the topology is Hard Switch Full Bridge.

My questions: Is there any risks of using the WLCSP81 package in bick power module? That would prefer if you could provide the information of the conditions/limitations of using WLCSP81 package. From my previous experience, QFN package are commom used in bick module, I'm not sure if WLCSP81could be used in this case.

Thanks

[Igor Cesko]

Hi JTan.5 ,

I think there is no problem. Mechanical properties should be similar: WLCSP package dimensions are ~ 4x4mm and QFN package 7x7mm. Number of balls are much more in WLCSP package (81) with comparison to QFN (48). Then is important the PCB design - temperature cycles on package.

Regards

Igor