XSPI trace lengths: what is "BGA package length" ?
In the documentation on STM32N657X0, it says that the memory must be connected with match length track on the boards.
It says:
Match length (including BGA package length)
- DQS0 with IO0..7 (Byte0), all in 50 mils,
- DQS1 with IO8..15 (Byte1), all in 50 mils,
- CLK is100 mils from any signal of Byte0 or Byte1
- NCS can be CLK +/-700 mils
But I can't find any documentation on "BGA package length".
It seems reasonable that the BGA package should be taken into account, since it is 12.8 mm.
and a precision of 1.27mm (50 mils) is specified.
I hope someone can help me find that documentation.
Keld
