Others: hardware and software

Hello ST team,   We are currently developing and ECU for tractor. The ECU have many Digital inout and outputs to interface with sensors and other subsytems of the tractor. For the GPIO we have identified the ESDALY device suitable, since it conforms to the ISO standards for ESD and transients ISO 7637-3 and ISO 10605. We are planning to use ESDA5V3LY for our digital input and output circuits in the ECU as the operational  voltage is 5V. Based on that we have designed the circuit for DI and DO and we did LTSpice simulation of the circuit too and found that results seems ok. Kindly help us in finalising the circuits before proceeding with PCB design, as there are very minimal reference circuits available. The circuits are attached for reference. Please reply.

Hi, Does anyone know what model the component is with code bellow:AAGP207Thanks,Alex

Hi,I am trying to use command line to compile self test of lsm6dsm by the following: arm-linux-gnueabi-gcc -static  lsm6dsm_self_test.c lsm6dsm_reg.c -o self test -I.and got error: lsm6dsm_self_test.c:159:21: error: ‘SENSOR_BUS’ undeclared (first use in this function)I couldn't find how to define SENSOR_BUS.I have tried:extern SPI_HandleTypeDef hspi1;#define SENSOR_BUS hspi1The device is connected using SPI.Regards.  

Hi Everyone! Even if this is just a minor inconsistency issue I would love to clarify it and might achieve an improved datasheet in the end. During our footprint review we found some inconsistent information about the chosen EMI filter EMIF06-MSD02N16.So, the CAD files are in Rev 1.0 from 2021 and we are not referring to that Altium example anyhow. In the datasheet, lastly editied in 2022, we are missing the information about the three GND pads and how to handle the two outer smaller ones. Sure, just add it to our footprint would be a pragmatic answer. Does the community have other thoughts? I summearized the information that we found at st.com: Datasheet  So before we are just adding these pads to be soldered in flexible manner, we are now wondering if: the outer GND pad are needed at all if they are internally connected anyhow if mechanical stability is the only purpose if they might be for shielding only Missing GND pads?   Thanks for your help! Mario

Hello Everyone,We are interfacing HDMI Connectors with a microprocessor such as AM625 or AM62P or RK3568 for use in Industrial HMI Controller environment.We would be using HDMI 2.0 or 2.1 data transfer rates.We plan to use a HDMI companion chip such as the HDMI2C4-5F2. We would like to use some filters between the ESD diode and the microprocessor for better immunity from noisy industrial environment.Circuit would typically be Connect ----> ESD Diodes ----> Filters ----> Microprocessor HDMI pins. ( ESD Diodes and Filters shall be typically placed close to the connectors ). For the TDMS pairs, we would use a common mode filter such as ECM4-2450A17M10.However, we wish to know, what kind of filters are required for SCL, SDA, HPD, Enable and VCC pins.Can you please recommend us some part numbers. Regards,Gaurav Joshi

Hello everyone,Is it possible to build a desktop application where each PC runs a Zephyr LwM2M client, and each IoT device also acts as an LwM2M client using CoAP for communication and management? This architecture could eliminate the need for an LwM2M server. However, this approach makes the PCs asynchronous.Is there a way to make them synchronized using a peer-to-peer communication model?

Dear ST, we are using STUSB1602 and STM32F072 MCU for our application DUAL DRP port functionality requirement in application. Hardware is design based on reference of P-NUCLEO-USB-002 development kit. in application one port where Android mobile is connected and initially device will take power from it.  When PD capable charger attached at  other port, we are able to read and request charger capability, and generates requested power profile from charger. after generated power profile  , we need to put Android phone in charging mode and hence PD attached to that port requires power role swap. here Problem starts.Mobile goes in charging with pd capability, but Fast role swap is not working, causes data communication with Mobile and device lost. After doing lots of debug it was found that there is no support of PD3.0 in SDK  hance  not capable to do fast role swap.We are using MB1303_DRP_DUAL_PORT_RTOS From X-CUBE-USB-PD-master repository.pleas

We need 24 bit low speed adc, i have found HX710B is low cost and 24 bit----but one big problem is it is chines manufaturer.can we use it for weighing scale with stm32f103 or stm8 series MCU reliably 

How to set the gain of GAIN0/GAIN1 pins 30/31 of TDA7491HV?  

Hi,I have a component (TVS diode I think) with marking MEPY Z805. Please see the attached image.Anyone can help me to get the P.N.?Thanks in advanceBest RegardsJonata

Edit by ST Moderator: This post has been translated from Chinese to comply with the ST Community Terms and Conditions (§10.2). The original can be found below. Hello! Material Model: MC33078DT, used in in-phase proportional amplification circuit, when the inverted end is grounded and the in-phase end is connected to 0.7V, abnormal: the output is close to the power supply voltage, when the inverted end is grounded and the in-phase end is connected to 0.8V, or greater than 0.8V, normal: the output is normal according to the amplification multiplier, please confirm whether it is related to the common mode voltage at the input? If it is related to the input common mode voltage, since the specification does not specify the input common mode voltage range, please help me to confirm what is the input common mode voltage of this model? What is the output level below the input common mode voltage? Single power supply VCC=5V, VCC-=0V: When the in-phase V+ is connected to 0.7V or below, an

Hello, I am reaching out for assistance regarding a wireless charging prototype I have developed based on the STEVAL-WBC2TX50 wireless power transmitter evaluation board.Here are the key details of my project:Design and Assembly- I followed the schematics, PCB layout, and reference designs provided in the UM3231 user manual.-All components were sourced according to the BOM, including the STSAFE-A110 chip.-I successfully assembled the PCB and flashed the firmware into the STWBC2-HP chipCurrent IssueThe wireless charger is not charging my Qi 1.3-compliant device (iPhone 11).When powered up and connected to the STSW-WBC2STUDIO GUI, the system remains in the WAIT State, with the PING_TIMEOUT event continuously logged.The Presence Detection values fluctuate, and the Bridge Voltage remains at 4.8 V, indicating that power transfer is not initiating.Suspected Issue:I suspect the issue may be related to the STSAFE-A110 chip, as it appears that the chip needs t

Hi!I'm having a hard time trying to figure out the pinout from the datasheet for the M24M02E-F Eeprom.I plan to use the WLCSP5 package but the package information chapter and the pin description chapter paints two completely different pictures and I don't know which one to use. The pin indicator are in opposite sides. I suppose the package information is the most correct one but if I use that, how are the pins situated then? Simply just mirrored from the pin description image?Unfortunately I'm not alllowed to upload images but this is the datasheet:https://www.st.com/resource/en/datasheet/m24m02e-f.pdfPackage information is at page 44, chapter 10.4Pin description is at page 3, figure 3. Thank you

I am currently working with the KG200ZABMD module and have a few technical queries regarding its power consumption and V_BAT pin functionality.1.Current Consumption DetailsI would like to understand the module’s current consumption (loading current)under different operating conditions:1.General power consumption in idle and sleep modes.2.LoRa transmission power consumption different dBm (decibels-milliwatts) and spread factors (SF).3.LoRa receive mode current consumption.If possible, please provide a detailed power consumption table or guidelines for optimizing power usage.2.V_BAT Pin Functionality1.What is the purpose of the V_BAT pin in this module?2.Does it serve as a backup supply for the RTC (Real-Time Clock)?3.What is the recommended current requirements for this pin?

Hi,The part# M95M04-DWDW3TP/V Marking is SM4W3, is it correct? because i unable find the marking info from datasheet for this part, please see the photos of product below, thanks.  

Hi, how to read the date code marking on M41T62LC6F. Example attached: 231C4 Thanks,   

Please could I have help identifying the component in the attached image to find a suitable replacement as it is shorted.I believe it's a TVS as it is placed between A +24V output and GND. I am unable to find the specific part number though. Many thanks, Jazz. 

Hi,I am using Stm32f0 as the modbus rtu MASTER, I have done setting up UART1 Rx and Tx for communication, I am sending the Master query to the Slave device (Simply Modbus Slave application) link https://www.simplymodbus.ca/download.htm. If I connect RX and Tx of mcu to USB to ttl converter then I am getting slave response but when I connect RS-485 to mcu and send a master query to slave then I'm not getting any response from a slave, attaching a code. Please help me. Thanks in advance. 

Hi, I am trying to find the Part Marking for M24C08-RDW6TP.Is there any datasheet for it? I already reviewed the datasheet but there is no any note for it. Thanks in advance.

Hello everyone, I am aiming to build a desktop application for configuring and monitoring IoT devices (e.g., routers, switches, ciphers, sensors, etc.). To achieve this, I am considering two architectural approaches:First Architecture:The desktop application acts as a centralized LwM2M server (using Eclipse Leshan) to manage and configure IoT devices.The IoT devices run Zephyr OS and act as LwM2M clients.Second Architecture:A backend-frontend architecture where:Backend-Frontend Communication: Uses WebSocket for real-time updates.Backend-Device Communication: Uses HTTP for scalability.The biggest advantage is that the backend can handle many requests from IoT devices without failing, ensuring scalability.I believe the second architecture is simpler and faster to implement compared to the first one. However, I need advice on the following:How to use the registry in LwM2M and how

Hello everyone,I'm trying to get an RTC output on pin C13 using a Bluepill STM32F103C8T6, but it's not working.I have connected LED to PC13 to see the LED blinks every 512hz but its on all the time.Can someone help me.

Hi,I have issue on Key Establish and Wrap/Unwrap example.I have X-NUCLEO-SAFEA1 and NUCLEO-L476RG for testing.I downloaded X-CUBE-SAFEA1 from ST web site, version is V1.2.2. Here's what I tried.I ran paring example. I commented out "_FORCE_DEFAULT_FLASH_" like "//#define _FORCE_DEFAULT_FLASH_" it works successfully.I ran All_Use_Cases example in Example_X-Cube_Cryptolib.Authentication worked.Key-pair generation worked.Key establish is failed.it fails at step 5, "5. Verify if shared secret is identical (0 means success): 49"StSafeA_AssignLVBuffer() function returns STSAFEA_INVALID_RESP_LENGTHpDestLVBuffer->Length was 16927 (looks like garbage value), but ExpectedLen was 32Wrap/unwrap is failed.it also fails at step 5, "5. Local envelope Local envelope demonstration result (0x0 means success): 0x6"StSafeA_ReceiveBytes() function returns STSAFEA_BUFFER_LENGTH_EXCEEDEDpOutBuffer->LV.Length was 65009 (garbage value), but STSAFEA_BUFFER_DATA_PACK

For some reason, I am not being able to set the frequency in the launcher but can change it successfully in gui.I am getting this invalid choice error:But I dont see any error in the argument: 

Good morning sir  Pls identify the component.i don't understand.d 

Title edited to make clear that this is emulated EEPROM - in the MCU's Flash.How to reset the EEPROM every time a new code is uploaded?Is this possible? Thank you very much.