Power management

Hello,I was checking the evaluvation board of VNF1048F for a efuse application to control motor drive. I wish to know how the capcitors for the charge pump selected in the evaluvation board. I am able to see 470nF in the evaluvation board schematics.Thank you,

We are using the PowerSTEP01 driver in Current mode to drive the NEMA23 stepper motor.Supply voltage: 24V DC, Motor current 0.9A set in driver  (motor max current is 2.1A)RPM Range 0 -1800 rpm; (0 - 6500 steps/sec)Acceleration / deceleration = 10000 steps/sec2FS_SPD is set to 2334 steps/sec (This is to achieve complete rpm range without stall)Boost mode is enabled at 3500 steps/sec to provide more torque at higher rpm. Currently, we are facing the following two major problems1) Motor stall problem :While changing stepper motor movement from 4500 steps/sec to 3000 steps/sec and vice versa, While changing the steps/sec value, the change is slow about 200 steps/sec at 200 msec intervalthe motor stall is observed while movement is from 4500 steps/sec to 3000 steps/sec.If the steps/sec change is drastic from 4500 steps/sec to 3000 steps/sec then there is not stall observed. 2) Unexpected motor status:We are reading PowerSTEP01 status registers at every 100 msec.When we c

I've been working with the MASTERGAN4L dev board to drive a transformer. This is for a purpose that will have to survive travel through deep space. I have a discretized roughly equivalent circuit made out of explicitly radiation tolerant / space rated components, but I know GaN is generally radiation tolerant, and I suspect I may be able to use the MASTERGAN4L and save a sizeable portion of board space. Do you have any information on the radiation tolerance of the MASTERGAN4L chips? Is there anything in the manufacturing process that you would identify as non-compatible with flight? There is also the possibility of customer-side radiation testing and space qualification.

Hi,I am working with this driver for a full H-Bridge inverter application (DC-AC). My requirements exceed the current rating for the SiC MOSFETs I am using. I am planning on paralleling MOSFETs to meet the current requirements, so I would like to know if there is any App Notes or recommendations on driving more than one MOSFET with this driver. Is there a limit on how many MOSFETs this can drive (other than the driving electrical characteristics)?  I am specifically interested in knowing if the Miller-Clamp pin can handle more than one MOSFET at a time.Thanks for your support on this matter. Note: I am currently using this eval-board to evaluate the drivers.https://www.st.com/resource/en/data_brief/evstgap2sicsac.pdf-J

I am designing a 200W 36V supply with STCMB1 driver, I am having problems with the circuit. The supply cannot supply the 6A of its capacity, it does not supply more than 800mA and the output voltage drops to 33V.

Hello, We plan to use the STWLC38 for power in a new wearable design. We purchased the STEVAL-WLC38RX and STEVAL-WBC86TX kits to get familiar and experiment with the ICs. Now we are trying to adapt the Rx of the STEVAL-WLC38RX as used in a wearable device and followed the application diagram from the STWLC38 datasheet (Figure 13. STWLC38 basic application diagram in Rx mode), using the recommended coil (Wurth 760308101219). We also changed the Cs and Cd capacitors as recommended. The STEVAL-WBC86TX board was not modified. The problem is that the power reception from the STEVAL-WBC86TX is not enough to reach 5V at the output. We tried changing the Cs according to STDES-WLC38WA (TN1440) as well as some other values with better results, but not enough. In the  chart of WPSTUDIO Vrect looks unstable, with lots of ripple and Vout is OFF. Do you have any suggestions on how to tune the Rx circuit with the new coil? Thank you, G.Giannopoul

We've developed prototype board with 3 pcs AL1262ZT (https://www.st.com/en/power-management/aled1262zt.html). As a 'fresh device' it has 0x40 I2C address and it's need to specify unique addr (0x42, 0x44, 0x46) by burn OTP register. Our procedure: 1. enable power supply 2. connect CS to 15V 3. write into device sample code:       #define CHIP_ADDRESS 0x40 //I2C ADDR #define REGISTER_ADDRESS 0x23 //BA_n_SAM_setting address [4:0] Wire.beginTransmission(CHIP_ADDRESS); Wire.write(REGISTER_ADDRESS); Wire.write(0x08); //add 4-th bit to have 0x48 addr Wire.endTransmission(); delay(1000); //do it twice Wire.beginTransmission(CHIP_ADDRESS); Wire.write(REGISTER_ADDRESS); Wire.write(0x08); Wire.endTransmission();       4. release CS to let it pull down by internal resistor 5. restart device   It still has 0x40 addr, but we need 0x48. There is no clear procedure how to use it other way in datasheet. Any hints will be much appreciated.

We use wireless charger RX IC stwlc38, though we tried to write firmware which provided by the link https://github.com/STwirelesscharger/STWLC38_NUCLEO_L476RG, but we met the CUT id mismatch during firmware writing via I2C interface and then the F/W writing was failed, anyone help to solve this issue or any reference code for stwlc38 or firmware?

Hello, I have a custom board with a STWLC38JRM. Everything was fine and I was able to flash it with STSW-WPSTUDIO v1.8.4 through the dev board STEVAL-WLC38RX and FT_SDA/FT_SCL/VBUS/AGND pins. I try to make some test and I disabled internal overtemperature protection in config. After that, I'm not able to connect to the STWLC38JRM again. I tried the chip with "RX" and "Empty" in WPSTUDIO without any success. I already had a similar issue and the chip was in Empty state. Is it possible to "factory reset" the chip without I2C link ? Thank you.

Hello,i have a board with 10 L6924D on it, the schematic of each channel is derived from STEVAL-ISA076V1(*). Charging works as planned, CC/CV, correct max voltage and charge current and charge-end-current. Both status pins are connected to LEDs as on the devboard, signaling correctly for charging, completed or error. All channels are sharing the 5V input and one line connecting all shutdown pins. The shutdown-line is pulled down by a N-fet to activate the charging or is pulled high to 5V with 10k.When activating the shutdown, the voltage on all chips is a clear 0V or 5V transition and all 10 channels stop charging as expected.What is not as expected, are the flickering status LEDs. Sometimes all are on, sometimes just one of them, sometimes none, and that random for each of the channels. One or two out of ten randomly fade between the LEDs within seconds and I can measure all voltages between 0V and 5V by multimeter and oscilloscope. There is no difference between battery connected or

I hope this is an appropriate group.  I don't see L6235Q anywhere. Is ST going to make any more Eval6235 boards?  There doesn't seem to be any on earth.  Choosing another controller is not an option. Mike

Hi, can anybody tell me what type of diode I see here?Marking is:GAAGP 843 Thanks.

I am buying a EVSPIN32G4 evaluation board. What are the things I should test or check on the new board for any faults or damages

Hello, I need to be able to generate a small DC voltage from an AC voltage.  The App Note 4260 looked absolutely perfect - exactly what I needed - 12V 150mA buck converter.  Simple. no flyback transformers, etc.  But I was a bit confused as to the GND connection on the IC.  It looks like it is connecting to the V-Out instead, with a diode to gnd.So i went into the edesign suite and used the exact same parameters.  the design it shows before you hit "Start design" also shows the diode to gnd on the GND pin, but it also shows another ground symbol.  Can you clarify the two different grounds?The other thing I noticed - it shows a bridge rectifier on the AC input before you tap "start design", but the app note and design you see after you tap "start design" just show the simple single diode rectifier. Can you clarify if I need to add a bridge rectifier on the front? Do I also need the other diode then?

Hi, I'm working on a board that has a USB PD input and a USB PD output.The board initialises via a generic PD 100W charger connected to the USB-C input, negotiating power for 20V / 5A via the STUSB4500. After this, I'm trying to source the voltage to a secondary board, connecting the STUSB4500 output directly to a PD Source chip, which will again connect to an STUSB4500 in this secondary board. I tried to do this with the STUSB4761 PD Source chip, but the chip is not negotiating or outputting any voltage. I realised the chip has a feedback pin and probably only works with AC/DC supplies. Is there anything I can do to make this work? In other words, this is the scheme I tried:External power supply (100W) > USB-C CABLE > PCB#1: STUSB4500 + STUSB4761 > USB-C CABLE > PCB#2: STUSB4500 and so on... (this will repeat on a daisy-chain for at least 6 PCBs).One more question, would it be better to have a STUSB4700 for the source in this situation? Can I link the STUSB4500 to an STUSB

Dear Team, I recently created a custom PCB where I wanted to implement the STUSB4710(A) for charging a phone and other accessories. The STUSB4710 should be plug and play without the need of configuring the PDO because it is already selected. I based my design on the valuation board of this IC: STEVAL-ISC004V1. I will attach a file with my schematics.So when I attach my Samsung A53 it will say that is is attached to a fast charger but when I look at the ampere app I charge with a current of 200mA which is almost nothing.So I started measuring and encountered an issue where the VBUS has a stable 5V which is good, but there isn't any current running from the to the usb-c connector as I also saw in the app. I read some registers trying to find out what the problem is via I²C and read the register of the CC_STATUS (0x11h) I found this in the file that was posted in a other post. here I can see that I get the following value 0x89 which means: (0x80) twisted cc2 lines (OK), (0x09)&n

Find a 3D model of STEVAL-CTM015V1,THANK YOU

I am working on steval -L3751V12 boardI am wanting the pcb files/ gerber files of the above demo board. can you help

Hi  I am using the X-NUCLEO-LPM01A and is it best to press the calibration button when my own circuit board is not connected, or do I press it after its connected and running?  What exactly is it calibrating against?The reset target button, does that simply reset the X-NUCLEO-LPM01A or kill and re-apply power my own circuit? Many thanksScott

I am evaluating the VN9D5D20F 4-channel high-side driver for a design (https://www.st.com/en/automotive-analog-and-power/vn9d5d20f.html).According to the datasheet, the PWM clock should be provided via the PWM_CLK input, but there's also this note about the PWM fallback clock:"When PWMCLOCKLOW warning flag is set, an internal fallback clock (at a typical frequency of 400 kHz) is usedto substitute the external one."My question is: can the fallback clock be used in place of providing a clock via the PWM_CLK input?  Does the fallback clock get divided and the duty cycle/phase applied as if it were coming from the PWM_CLK input?

Can i use STGAP2SICSA gate driver  for silicon MOSFET  or can you suggest me AEQ qualified high side smart gate driver with has short circuit current protection with inbuilt charge pump to drive high side MOSFET.

Hi,Is there a solution to use PCB based Rogowski coil with STPM33 from 200 mA to 200 A with 0.2 Class Metering accuracy as per ANSI C12.20 

Is there a Spice model of the MC34063?  I checked the CAD resources, but I do not see simulation models. Thanks

Hello,I am using the TCPP03-M20, and would like to save space/cost by combining the Source and Sink path into one mosfet gate pair.The datasheet provides an example of a combined source/sink path using two Schottky diodes and a 1M resistor with the side effect of increasing the gate transition time to 1ms. With the voltages/currents in my application this is enough to cause the mosfets to overheat and fail.What would you suggest for preventing this failure?Is it possible to change the library code for this chip to allow the use of only the source path for both sourcing and sinking?Thanks,Nate  

Hello,thermal data of the L78M show junction-to-ambient thermal resistance (θJA) and junction-to-case thermal resistance (θJC) for different packages (e.g., TO-220 and DPAK). Those figures differ, of course. Note that the datasheet provides no junction-to-board thermal resistance (θJB). I wonder which are the relevant figures for TO-220 and DPAK packages for calculating thermal response: The TO-220 package is mounted through hole and usually the package's thermal pad has no contact to the board. Thus heat is just just dissipated to surrounding air. Optionally, a heat sink is mounted on the thermal pad. Therefore I assume that the θJA is the relevant figure.The DPAK package is a surface mounted device. As the thermal pad is soldered to the board, the θJC should be more relevant.Is that correct? Please advise! I'd also appreciate if you'd provide an application note that provides a better understanding of thermal resistance data.Thanks.&n