In the LPS22HB datasheet , there is a statement " The package is holed to allow external pressure to reach the sensing element." Is there a hole somewhere in the part package that should not be covered up, and should be kept clear of obstructions?

[TSemk.1]

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[OSell.1]

This is a good question. I went to google and looked at the images of some of these sensors. I didn't see any crazy obvious holes in the package. But based on what is typical for these types of pressure sensors and what I saw. I believe it is likely on the top where the window is.

[S.Ma]

Usually if the hole is not done on the plastic package, it is very small on the silicon exposed cap area of the package. Pressure doesn't need a "big" hole. Humidity sensors do as humidity is like a cloud, needs movement... a fan ideally.

[Eleon BORLINI]

Hi,

@S.Ma​  is right, you can have a look to this picture

-Eleon

[TSemk.1]

Thanks for the information. These are extremely small diameter holes barely seen under my microscope. So I assume the MEMs diaphragm is somewhere in the cavity below the "silver foil" cover with the 6 holes? ( I originally maybe wrongly assumed that the silver foil was not holed and was the diaphragm that flexed with changes in the atmosphere pressure).

[Eleon BORLINI]

Hi @TSemk.1​ ,

correct (the silver foil is actually a silicon cap)

-Eleon