Manual soldering profile details

[AG1]

Hi,

need information about the soldering profile for LQFP100 pin package in case, soldering the IC manually with temperature controlled soldering station

[AScha.3]

Hi,

a soldering profile depends on the process for the used tin , not on the case of the parts.

So see the standard profile for your solder.

for RoHS, Pb free:

 

[AG1]

Hi,

It seems max. temperature for soldering will be 260degC for manual process also on temperature controlled soldering station, then what could be temperature for de-soldering it?

as, during initial board bring up & trouble shooting , i would like to ensure that chip should not get damage during any process

[AScha.3]

Hi,

> temperature for de-soldering 

same as soldering, but maybe somewhat higher, because chip anyway going to trash then.

So its more : not damage the board. I use 350° (hot air) for desoldering, or hot plate at 260°.

The chips/parts usually not very sensitive to high temp. , if its just for short time.

https://www.ablic.com/en/semicon/support/package/solder-temp-profile/

 

For hand soldering typical recommendation is:  Resistance to soldering heat 260 °C/ 5 s  . (for relais here)

And as always: important is the flux , good flux.   And the way, you do it...experience helping a lot.

My preferred (and cheap) flux is NC-559 (see on Ali or ebay) , works fine with lead and lead free solder.

https://youtu.be/rUmzN30lwP4

btw

I had already chips soldered and desoldered 2 times, chip still working fine. (at repairing boards with problems)

[KDJEM.1]

Hello @AG1 ;

 

I recommend you to look at Soldering recommendations and package information for lead-free ECOPACK2 MCUs and MPUs - Application note may help you.

 

Thank you.

Kaouthar

[AG1]

thanks, already went through document, but unable to get the required info.

[TDK]

The chips are not particularly sensitive or delicate. Heat them up until the solder melts, hold a couple seconds, then let them cool down.

If you want the best reliability, use the recommended reflow profiles.