Hi!
I'm using the L6924D chip for a university, and just saw a pin called EP. Searching on net, it is pointed that it's used for thermal purposes. Is that correct? If it is, what is the best approach for optimizing this parameter, considering the module will be confined in a box, inside another box?
Thank you in advance!
EP stands for Exposed Pad, which is used to improve thermal performance. This is common on many chips and generally it should be connected to GND. This chip is no exception:
There are guidelines given in the datasheet. Basically, it should be well connected to a large ground plane which acts as a heat sink.
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