How to Interpret HCI/LMP Subversion for STM32WB55xx

[dagraves1]

I am working with the STM32WB55VGQ6 and using the V1.23.0 / 02-June-2025 STM32WB Copro Wireless Binaries. Specifically,  stm32wb5x_FUS_fw.bin @ 0x080EE000 and stm32wb5x_BLE_Stack_full_fw.bin @ 0x080D0000.

The STM32WB BLE API (hci_le) provides the function to read the values for the version information for the local Controller (`hci_read_local_version_information`).

Per the BLE Core 5.4 spec:

The HCI_Version information defines the version information of the HCI layer. The LMP_Version information defines the version of the LMP. The Company_Identifier information indicates the manufacturer of the local device.

The HCI_Subversion and LMP_Subversion are vendor-specific.

Since the Bluetooth Core Specification defines these as vendor-specific, could you please provide documentation on how to interpret them for your devices?

Specifically, I'd like to know:

1. Where are these values documented?
2. How can we decipher them to understand details like the silicon revision or firmware patch level?

Thank you for your assistance.

[dagraves1]

@Remi QUINTIN Are you able to help me out with this information?

[Remi QUINTIN]

hello

This information is not public as they are only used for our ST internal purpose to run our product tests. 

Moreover it may change over time depending on our internal usage.